| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition which can provide a laminate which is excellent in heat resistance, has a small coefficient of linear expansion and shows a good adhesion to a conductor circuit, and a prepreg using the same and the laminate. SOLUTION: The resin composition is used for forming the sheet-form prepreg by impregnating a substrate with the resin composition. The resin composition contains an epoxy resin containing a dicyclopentadiene epoxy resin and a biguanide compound. The prepreg is obtained by impregnating the substrate with the resin composition. The laminate is obtained by molding at least one prepreg. COPYRIGHT: (C)2005,JPO&NCIPI |
