发明名称 RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a resin composition having excellent adhesion to lead frames and reliability of moisture resistance. SOLUTION: This resin composition comprises a thermosetting resin, an inorganic filler and a release agent. The release agent is a polyolefin wax obtained by oxidizing a polyolefin manufactured by using a metallocene catalyst. Preferably, the thermosetting resin is an epoxy resin or a phenolic resin. The thermosetting resin composition contains the release agent in an amount of 0.03-1.00 wt.% of the total composition. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005225965(A) 申请公布日期 2005.08.25
申请号 JP20040035472 申请日期 2004.02.12
申请人 MITSUI CHEMICALS INC 发明人 UOSAKI HIROTAKA
分类号 C08L101/00;C08K3/00;C08L23/00;(IPC1-7):C08L101/00 主分类号 C08L101/00
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