发明名称 |
Fluid ejection device metal layer layouts |
摘要 |
A fluid ejection device comprises a first metal layer and a second metallayer. The first metal layer comprises an address path portion and a nonaddress path portion. The second metal layer, which overlies the first metal layer, comprises a first portion which comprises a power conducting portion. The power conducting portion is routed only over the non-address path portion of the first metal layer.
|
申请公布号 |
US2005185022(A1) |
申请公布日期 |
2005.08.25 |
申请号 |
US20040787573 |
申请日期 |
2004.02.25 |
申请人 |
BRUCE KEVIN;TORGERSON JOSEPH M.;BENJAMIN TRUDY;MILLER MICHAEL D. |
发明人 |
BRUCE KEVIN;TORGERSON JOSEPH M.;BENJAMIN TRUDY;MILLER MICHAEL D. |
分类号 |
B41J2/05;B41J2/14;(IPC1-7):B41J2/05 |
主分类号 |
B41J2/05 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|