SEMICONDUCTOR DEVICE PACKAGE UTILIZING PROUD INTERCONNECT MATERIAL

摘要

A semiconductor package which includes a conductive can (48), a semiconductor die (40) received in the interior of the can and connected to an interior portion thereof at one of its sides, at least one interconnect structure (19') formed on the other side of the semiconductor die, and a passivation layer (50) disposed on the other side of the semiconductor die around the interconnect structure and extending at least to the can.