| 摘要 |
In one example of the invention, an interconnect assembly for printed circuit boards comprises a first substrate (602), a first resilient contact element (609) and a stop structure (607). The first resilient contact element (609) has at least a portion which is capable of moving to a first position in which said first resilient contact element (609) is in mechanical and electrical contact with a second contact element (605). The first resilient contact element (609) and the stop structure (607) are disposed on said first substrate (602), wherein said stop structure (607) defines said first position. |
