COPPER OR COPPER ALLOY SHEET/BAR STOCK FOR ELECTRONIC COMPONENT, AND PRODUCTION METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a copper or copper alloy sheet/bar stock for a heat sink having excellent resin adhesion and electric insulation properties. SOLUTION: The copper or copper alloy sheet/bar stock has a silane compound film having a coating weight of≥0.5 mg/m2expressed in the terms of Si formed on the outermost surface, and an oxide film with a thickness of 1,000 to 2,000Åformed on the lower layer thereof. A production method therefor comprises: coating the surface of a copper or copper alloy sheet/bar with a silane coupling agent aqueous solution heated at 40 to 60°C to form the silane compound film on the surface; then applying heating treatment to the silane compound film to form an oxide film of the copper or copper alloy sheet/bar on the lower layer of the silane compound film. COPYRIGHT: (C)2005,JPO&NCIPI