发明名称 |
Method and structure for determining thermal cycle reliability |
摘要 |
A device and method for evaluating reliability of a semiconductor chip structure built by a manufacturing process includes a test structure built in accordance with a manufacturing process. The test structure is thermal cycled and the yield of the test structure is measured. The reliability of the semiconductor chip structure built by the manufacturing process is evaluated based on the yield performance before the thermal cycling.
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申请公布号 |
US2005186689(A1) |
申请公布日期 |
2005.08.25 |
申请号 |
US20040783462 |
申请日期 |
2004.02.20 |
申请人 |
FILIPPI RONALD G.;GILL JASON P.;MCGAHAY VINCENT J.;MCLAUGHLIN PAUL S.;MURRAY CONAL E.;RATHORE HAZARA S.;SHAW THOMAS M.;WANG PING-CHUAN |
发明人 |
FILIPPI RONALD G.;GILL JASON P.;MCGAHAY VINCENT J.;MCLAUGHLIN PAUL S.;MURRAY CONAL E.;RATHORE HAZARA S.;SHAW THOMAS M.;WANG PING-CHUAN |
分类号 |
H01L21/66;H01L23/544;(IPC1-7):H01L21/66 |
主分类号 |
H01L21/66 |
代理机构 |
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地址 |
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