| 发明名称 |
Substrate for carrying a semiconductor chip and a manufacturing method thereof |
| 摘要 |
A substrate includes a plurality of insulation layers forming a laminated structure and a built-in capacitor formed in the laminated structure, wherein the laminated structure includes a layer of baked organic polysilane. |
| 申请公布号 |
US2005185382(A1) |
申请公布日期 |
2005.08.25 |
| 申请号 |
US20050112343 |
申请日期 |
2005.04.22 |
| 申请人 |
OOI KIYOSHI;HORIKAWA YASUYOSHI |
发明人 |
OOI KIYOSHI;HORIKAWA YASUYOSHI |
| 分类号 |
H05K3/46;H01L21/56;H01L21/68;H01L23/12;H01L23/498;H05K1/16;(IPC1-7):H01L21/44;H01L21/48;H01L21/50;H01L21/824;H05K7/20 |
主分类号 |
H05K3/46 |
| 代理机构 |
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代理人 |
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| 主权项 |
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