| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To diffuse and transfer the heat of a heating element as a body to be cooled mounted on a heatsink more uniformly to a substrate and the radiation fin side. <P>SOLUTION: The heatsink has the plate-shaped substrate composed of a good thermal conductor and a plurality of the radiation fins mounted on one main surface of the substrate, the heating element as the body to be cooled is fitted on the other main surface of the substrate, and the heating element is cooled. In the heatsink, a plurality of linear pores are dispersed in the substrate, and disposed in parallel and pore rows are formed. In the heatsink, headers mutually making each pore of the pore rows communicate and hermetically sealing each pore are secured at both ends of these pore rows, and a cooling medium is sealed into each hermetically sealed pore, thus constituting a heat pump. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
