| 摘要 |
PROBLEM TO BE SOLVED: To provide thin film element transfer technique capable of largely reducing time required to inject an adhesive into a gap between a transfer source substrate and a transfer destination substrate. SOLUTION: The thin film element transfer technique includes a step of forming a material (12) to be transferred via a stripping layer on the transfer source substrate (10), a step of forming a surrounding part (14) for surrounding the region to be transferred on the source substrate, a step of sticking both the transfer source substrate and the transfer destination substrate (20) to each other to have a closed space defined by both substrates, a step of putting the joint of the source substrate and the destination substrate in a pressure-reduced atmosphere, a step of providing an adhesive in one of openings of a through hole (22) provided beforehand on the destination substrate, a step of exposing the joint to an atmosphere with a higher pressure than the pressure-reduced atmosphere and injecting the adhesive through the through hole into the closed space, a step of hardening the adhesive, a step of weakening adhesion of the stripping layer, and a step of transferring the material to be transferred on the target region fixed to the destination substrate via the adhesive to the destination substrate. COPYRIGHT: (C)2005,JPO&NCIPI
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