| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a through hole, in which when the through hole is formed in a printed wiring board, burrs will not occur, a special tool is not necessary and solder failures will not occur. SOLUTION: In the method for forming the through hole in the printed wiring board which is formed by stacking a metal foil on at least one face of an insulating substrate, a stacked body formed from layers, having a different ductility is placed in the metal foil to form the through hole in the printed wiring board. Thus, a method can be provide for forming the through hole, in which the burrs will not be generated, special tools are not quired, and the solder faults will not occur. COPYRIGHT: (C)2005,JPO&NCIPI
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