发明名称 CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a circuit board wherein the reliability of soldering between a connecting part and a portion to be attached can be improved. SOLUTION: Since pierced holes 20 are formed in the connecting part 12 of a terminal 10, fillets 32A of solder 32 are formed not only on a side surface of the joint 12, but also on the inner surface of the pierced holes 20, when the surface of a land 31 and the joint 12 are connected with solder 32. Moreover, when a slight clearance exists between the surface of the land 31 and the connecting part 12, solder which flowed-in from the pierced holes permeates the clearance, the surface of the land 31 and the connecting part 12 are fixed firmly with more solder. As a result, reliability of soldering between the surface of the land 31 and the connecting part 12 is improved. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005228898(A) 申请公布日期 2005.08.25
申请号 JP20040035681 申请日期 2004.02.12
申请人 DENSEI LAMBDA KK 发明人 NAGASAWA YASUO
分类号 H05K1/18;H01L23/50;H05K1/14;(IPC1-7):H01L23/50 主分类号 H05K1/18
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