| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing semiconductors excellent in fluidity, moldability and solder resistance. SOLUTION: The epoxy resin composition for sealing semiconductors comprises an epoxy resin, a phenolic resin, a curing accelerator, fused silica having an average particle size of 5-40μm and fused silica having an average particle size of 0.1-3μm and a silanol group density on the surface thereof of larger than 2.1 pieces/nm<SP>2</SP>and not larger than 4.0 pieces/nm<SP>2</SP>. The semiconductor device is obtained by sealing a semiconductor device by using the same. COPYRIGHT: (C)2005,JPO&NCIPI |
