| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multi-layer and double-sided substrate in a laminate type for reducing the percent defective of a product. SOLUTION: At least one or more protrusions 1 are formed on the surface of a flat first base material 3, and an insulating film and an elastic body 7 are successively arranged so as to be overlapped on the surface of the first base material 3 formed with the protrusions 1; and the elastic body 7 is pressurized with a fixed pressure, while the film is heated so that the film arranged on the protrusions can be adhered to the first base material 3 with the elastic force of the elastic body 7, and that the film thickness on the protrusions can be thinly expanded. The surface of the thinly expanded film is removed by a plasma etching method so that the film can be removed with a uniform thickness in the atom level. As a result, the insulating film of even a thin substrate, which is easily folded such as a flexible substrate, can be removed with uniform thickness. COPYRIGHT: (C)2005,JPO&NCIPI |
