| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide metal laminate and a circuit substrate, wherein a troublesome vacuum process is not required, and strong adhesion can be attained by a wet deposition process and a practical adhesion can be kept even under aging treatment at a high temperature and a good reliability to electric insulation can be attained. SOLUTION: In the polyimide metal laminate, an electrically conductive metal layer is formed on a polyimide film at least whose surface is subjected to ceramic or pseudo-ceramic modification by a wet metal deposition process capable of conducting a metal deposition on a ceramic. The metal laminate has 0.5 kg/cm or higher even after aging in air at 150°C. A photosensitive resist layer is formed before or during the metal deposition process, and a resist on pattern-forming parts is removed by a photo process and an electrical conductive metal layer deposition is developed on the removed parts, whereby a circuit is formed. COPYRIGHT: (C)2005,JPO&NCIPI |
