发明名称 Semiconductor device
摘要 A semiconductor device comprises a first-conductivity-type semiconductor substrate, a first-conductivity-type first semiconductor layer formed on the semiconductor substrate, a second semiconductor layer formed on the first semiconductor layer and has a first-conductivity-type impurity concentration higher than that of the first semiconductor layer, a second-conductivity-type first semiconductor region selectively formed on an upper surface of the first semiconductor layer at a boundary with the second semiconductor layer, a source electrode selectively formed on the second semiconductor layer and achieves ohmic contact with the second semiconductor layer and the first semiconductor region, a gate electrode selectively formed on the second semiconductor layer and achieves Schottky contact with the second semiconductor layer, and a drain electrode formed on a lower surface of the semiconductor substrate and achieves ohmic contact with the semiconductor substrate.
申请公布号 US2005184317(A1) 申请公布日期 2005.08.25
申请号 US20040024419 申请日期 2004.12.30
申请人 HATAKEYAMA TETSUO;SHINOHE TAKASHI 发明人 HATAKEYAMA TETSUO;SHINOHE TAKASHI
分类号 H01L21/28;H01L21/06;H01L21/8232;H01L21/8234;H01L27/06;H01L27/088;H01L27/095;H01L29/24;H01L29/47;H01L29/80;H01L29/808;H01L29/872;(IPC1-7):H01L29/80 主分类号 H01L21/28
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