HIGH ASPECT RATIO C-MEMS ARCHITECTURE

摘要

CMEMS architecture having high aspect ratio carbon structures and improved methods for producing high aspect ratio CMEMS structures are provided. high aspect ratio carbon structures are microfabricated by pyrolyzing a patterned carbon precursor polymer. In a multi-step process in an atmosphere of inert and forming gas at high temperatures that trail the glass transit temperature (Tg) for the polymer. Multi-layer CMEMS carbon structures are formed from multiple layers of negative photoresist, wherein a first layer forms carbon interconnects and the second and successive layers form high aspect ratio carbon structures. High-conductivity interconnect traces to connect CMEMS carbon structures are formed by depositing a metal layer on a substrate, patterning a polymer precursor on top of the metal layer and pyrolyzing the polymer to create the final structure. The interconnects of a device with high aspect ratio electrodes are insulated using a self aligning insulation method.