| 摘要 |
A method uses a three-dimensional, adhesive-infused, woven preform to assemble two components, each component having z-pins extending from bonding surfaces. The components and preform are assembled with surfaces of the preform contacting surfaces of the components, the z-pins penetrating into the preform. The perform is equal or slightly greater in thickness than the protrusion lengths of the z-pins. The adhesive in the preform is then cured, adhering the preform to the components and retaining the z-pins within the preform.
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