AC grounding structure for electronics enclosure

摘要

An electronic device enclosure grounding structure ( 200 ) that provides a low impedance path to ground for selected AC frequencies. A conductive portion of an electronic enclosure, such as a conductive back ( 108 ) of a cell phone ( 100 ) has a capacitive coupling to a second surface ( 206 ) that is conductively isolated from the enclosure. Second surface ( 206 ) is connected to a ground point ( 207 ) through a conductive arm ( 205 ) that has a predefined inductance. The resulting series capacitance-inductance circuit ( 300 ) allows a reactive connection between the enclosure ( 108 ) and ground ( 207 ) that has a settable resonant frequency.