发明名称 |
Novel thin laminate as embedded capacitance material in printed circuit boards |
摘要 |
The invention concerns multilayered structures useful for forming capacitors, which may be embedded within printed circuit boards or other microelectronic devices. The multilayered structure comprises a pair of parallel electrically conductive layers separated by a pair of dielectric layers and a central polymerizable layer. Each of the dielectric layers and the central layer may include a filler. Capacitors formed from the multilayered structures of the invention exhibit excellent short circuit resistance as well as excellent void resistance.
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申请公布号 |
US2005186437(A1) |
申请公布日期 |
2005.08.25 |
申请号 |
US20040782130 |
申请日期 |
2004.02.19 |
申请人 |
OAK-MITSUI, INC. |
发明人 |
PRAMANIK PRANABES K. |
分类号 |
B32B15/08;B32B15/20;B32B27/20;B32B27/34;B32B27/38;H01G4/20;H01L21/48;H01L23/498;H01L23/64;H05K1/16;(IPC1-7):B32B27/38;B32B27/08 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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