发明名称 METHOD FOR SELECTIVE ETCHING
摘要 <p>Disclosed is a method of selective etching a first material on a substrate with a high se­lectivity towards a second material by flowing a liquid etchant across a substrate surface at a flow sufficient fast to generate a mininun mean velocity v parallel to the substrate's surface.</p>
申请公布号 WO2005078783(A1) 申请公布日期 2005.08.25
申请号 WO2005EP50510 申请日期 2005.02.07
申请人 SEZ AG;INTERUNIVERSITAIR MICRO-ELEKTRONICA CENTRUM VZW;KRAUS, HARALD;CLAES, MARTINE 发明人 KRAUS, HARALD;CLAES, MARTINE
分类号 H01L21/311;H01L21/336;(IPC1-7):H01L21/311 主分类号 H01L21/311
代理机构 代理人
主权项
地址