发明名称 |
METHOD FOR SELECTIVE ETCHING |
摘要 |
<p>Disclosed is a method of selective etching a first material on a substrate with a high selectivity towards a second material by flowing a liquid etchant across a substrate surface at a flow sufficient fast to generate a mininun mean velocity v parallel to the substrate's surface.</p> |
申请公布号 |
WO2005078783(A1) |
申请公布日期 |
2005.08.25 |
申请号 |
WO2005EP50510 |
申请日期 |
2005.02.07 |
申请人 |
SEZ AG;INTERUNIVERSITAIR MICRO-ELEKTRONICA CENTRUM VZW;KRAUS, HARALD;CLAES, MARTINE |
发明人 |
KRAUS, HARALD;CLAES, MARTINE |
分类号 |
H01L21/311;H01L21/336;(IPC1-7):H01L21/311 |
主分类号 |
H01L21/311 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|