发明名称 |
METHOD FOR SUPPRESSING INCREASE WITH ELAPSE OF TIME OF CONTACT RESISTANCE OF ELECTRONIC PARTS, AND FIBER FOR SUPPRESSING INCREASE WITH ELAPSE OF TIME OF CONTACT RESISTANCE, AND FIBER PRODUCT USING THE FIBER |
摘要 |
<p>A method for suppressing the increase with the elapse of time of the contact resistance of electronic parts, which comprises placing a fiber product containing fine particles of a metal and/or a metal compound being reactive with a sulfur compound and sparingly soluble in water, being dispersed therein, inside and/or outside of a device having electronic parts therein; and a fiber for suppressing the increase with the elapse of time of the contact resistance of electronic parts, characterized in that it contains fine particles of a metal and/or a metal compound being reactive with a sulfur compound and sparingly soluble in water, being dispersed therein.</p> |
申请公布号 |
WO2005078181(A1) |
申请公布日期 |
2005.08.25 |
申请号 |
WO2005JP01546 |
申请日期 |
2005.01.27 |
申请人 |
JAPAN EXLAN CO., LTD.;TOYO BOSEKI KABUSHIKI KAISHA;TAKAHASHI, TOMOMI;TSURUMI, HIDEYUKI |
发明人 |
TAKAHASHI, TOMOMI;TSURUMI, HIDEYUKI |
分类号 |
H05K3/34;D06M11/00;H05K3/28;(IPC1-7):D06M11/00 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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