发明名称 MOLD TEMPERATURE ADJUSTING DEVICE, HEAT RECOVERY TANK USED THEREIN AND TEMPERATURE ADJUSTING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a mold temperature adjusting device for shortening the cycle time of a process by adjusting the changeover timing of a high temperature medium and a low temperature medium anticipating the delay of the heat transfer of heating and cooling in both of the high temperature medium and the low temperature medium, reducing a temperature change with respect to the set temperature of the high temperature medium and the low temperature medium, reducing energy loss and obtaining a mold temperature optimum to an injection process. <P>SOLUTION: The mold temperature adjusting device is equipped with a high temperature fluid tank 4, a low temperature fluid tank 3, a high temperature fluid supply system 41 and a high temperature fluid return system 42 both of which connect a mold 2 and the high temperature fluid tank 4, a low temperature fluid supply system 31 and a low temperature fluid return system 35 both of which connect the mold 2 and the low temperature fluid tank 3, a high temperature fluid bypass system 43, a low temperature fluid bypass system 40, the heat recovery tank 5 connected to the high temperature fluid tank 4 and a pressure adjusting means. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005225042(A) 申请公布日期 2005.08.25
申请号 JP20040035189 申请日期 2004.02.12
申请人 MITSUBISHI HEAVY IND LTD 发明人 MURANAKA OSAMU;TODA NAOKI;BESSHO MASAHIRO
分类号 B29C45/73;B29C33/04;(IPC1-7):B29C45/73 主分类号 B29C45/73
代理机构 代理人
主权项
地址
您可能感兴趣的专利