发明名称 Thermosetting adhesive or pressure-sensitive adhesive composition and thermosetting adhesive or pressure-sensitive adhesive tape or sheet
摘要 The thermosetting adhesive or pressure-sensitive adhesive composition contains 100 parts by weight of an acrylic polymer (X) containing from 60 to 75% by weight, based on the total amount of monomer components, of an alkyl(meth)acrylate (a) in which the alkyl moiety thereof has from 2 to 14 carbon atoms, from 20 to 35% by weight, based on the total amount of monomer components, of a cyano group-containing monomer (b), and from 0.5 to 10% by weight, based on the total amount of monomer components, of a carboxyl group-containing monomer (c) as monomer components; and from 1 to 20 parts by weight of a carbolic acid based resol type phenol resin (Y) represented by the following formula (1): In the formula (1), R<SUP>1 </SUP>represents -CH<SUB>2</SUB>- or -CH<SUB>2</SUB>-O-CH<SUB>2</SUB>-; n represents a positive integer; and m represents an integer of from 1 to 4.
申请公布号 US2005187348(A1) 申请公布日期 2005.08.25
申请号 US20050063540 申请日期 2005.02.24
申请人 NITTO DENKO CORPORATION 发明人 SONOBE MIYOKO;OHURA MASAHIRO
分类号 C09J7/00;B32B7/12;C08L61/06;C09J7/02;C09J133/00;C09J133/06;C09J133/14;C09J133/18;C09J133/20;C09J161/06;C09J161/10;H05K1/00;H05K3/38;(IPC1-7):C08K5/07 主分类号 C09J7/00
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