| 摘要 |
PURPOSE: To obtain method and system for producing a semiconductor device in which particles, adhered to a substrate at the time of laser stamping, are removed effectively. CONSTITUTION: The semiconductor production system comprises a stage 1 for mounting a substrate 7, means 2 for stamping a character or a symbol, and a plate 3 disposed movably up and down above the stage such that the lower end part thereof approaches the border between a stamped region 7a and an element forming region 7b of the substrate through a narrow gap to cover the element forming region. The method for producing a semiconductor device comprises a step for scrubbing the rear side of the substrate 7 stamped with a character or a symbol, and a step for scrubbing the surface of the substrate. |
