IMAGE SENSOR MODULE AND CAMERA MODULE PACKAGE THEREWITH

摘要

A camera module package includes an image sensor module that can be formed as a chip scale package (CSP) with a wire bonding structure. The image sensor module includes an image sensing device unit having an image sensing device, a pixel area part formed on a surface of the image sensing device, and a device connecting pad formed on a surface of the image sensing device for electrically connecting to external devices; a circuit board to which the image sensing device unit is attached on one surface, to which a board connecting pad that is electrically connected to the image sensing device unit is formed on the other surface, and that contains holes corresponding to locations of the pixel area part and the device connecting pad; and a connecting unit for connecting the device connecting pad and the board connecting pad.