摘要 |
A positive photosensitive resin precursor composition which can be can be developed in an alkaline developer is provided. The positive photosensitive resin precursor composition comprises (a), one of (b1) and (b2), and (c): (a) a polyamic acid ester and/or a polyamic acid polymer, both of which are soluble in an alkaline aqueous solution; (b1) a phenolic-hydroxyl-group-containing thermally crosslinkable compound comprising an organic-group-R<SUP>1</SUP>-substituted methylol group represented by formula (1) (wherein R<SUP>1 </SUP>is not a hydrogen atom), <?in-line-formulae description="In-line Formulae" end="lead"?><img id="PRIVATE-USE-CHARACTER-00001" he="7.20mm" wi="8.47mm" file="US06933087-20050823-Parenopenst.TIF" alt="private use character Parenopenst" img-content="character" img-format="tif" />CH<SUB>2</SUB>-OR<SUP>1</SUP>) (1);<?in-line-formulae description="In-line Formulae" end="tail"?> (b2) a thermally crosslinkable compound containing a ureal organic group substituted by an organic group R<SUP>1 </SUP>and represented by formula (2) (c) an esterified quinone diazide compound.
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