发明名称 Multi-station deposition apparatus and method
摘要 A multi-station deposition apparatus capable of simultaneous processing multiple substrates using a plurality of stations, where a gas curtain separates the stations. The apparatus further comprises a multi-station platen that supports a plurality of wafers and rotates the wafers into specific deposition positions at which deposition gases are supplied to the wafers. The deposition gases may be supplied to the wafer through single zone or multi-zone gas dispensing nozzles.
申请公布号 US6932871(B2) 申请公布日期 2005.08.23
申请号 US20020124309 申请日期 2002.04.16
申请人 APPLIED MATERIALS, INC. 发明人 CHANG MEI;LEI LAWRENCE C.;GLENN WALTER B.
分类号 C23C16/44;C23C16/455;C23C16/458;C23C16/54;H01L21/00;(IPC1-7):C23C14/24 主分类号 C23C16/44
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