Circuit component built-in module, radio device having the same, and method for producing the same

摘要

A circuit component built-in module capable of mounting the circuit component with high density and having high heat releasing property and the high reliability. The circuit component built-in module 100 includes the insulating substrate 101 made of a first mixture 105 and a second mixture 106 , wiring patterns 102 a and 102 b formed on one principal surface and another principal surface of the insulating substrate 101 , a circuit component 103 a electrically connected to the wiring pattern 102 a and sealed with the second mixture 106 in an internal portion of the insulating substrate 101 , the inner via conductor 104 electrically connecting the wiring pattern 102 a and 102 b.