发明名称 Apparatus and method for loading a wafer in polishing system
摘要 The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.
申请公布号 US6932679(B2) 申请公布日期 2005.08.23
申请号 US20020295197 申请日期 2002.11.15
申请人 ASM NUTOOL, INC. 发明人 TALIEH HOMAYOUN;VOLODARSKY KONSTANTIN;ASHJAEE JALAL;YOUNG DOUGLAS W.
分类号 B24B21/04;B24B21/08;B24B21/22;B24B37/04;B24B47/04;B24B49/16;(IPC1-7):B24B1/00 主分类号 B24B21/04
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