发明名称 |
Tablet comprising epoxy resin composition |
摘要 |
A tablet for producing a semiconductor device with substantially no bowing, comprising an epoxy resin composition comprising an epoxy resin and a curing agent, wherein the tablet has the characteristic of an amount reduced by heating being less than 0.05% by weight; a wafer with a resin layer and a semiconductor device produced by using the tablet; and a process for producing the wafer and the semiconductor device.
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申请公布号 |
US6933618(B2) |
申请公布日期 |
2005.08.23 |
申请号 |
US20040843339 |
申请日期 |
2004.05.12 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
KUROYANAGI AKIHISA;ITO HISATAKA;SUDO SHINICHIROU;OONO HIROFUMI |
分类号 |
H01L23/10;C08L61/08;H01L21/56;H01L23/498;(IPC1-7):H01L23/28 |
主分类号 |
H01L23/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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