| 发明名称 |
Large bumps for optical flip chips |
| 摘要 |
The invention provides bumps between a die and a substrate with a height greater than or equal to a height of a waveguide between the die and the substrate. The bumps may be formed on a die prior to that die being singulated from a wafer. |
| 申请公布号 |
US6933171(B2) |
申请公布日期 |
2005.08.23 |
| 申请号 |
US20030691136 |
申请日期 |
2003.10.21 |
| 申请人 |
INTEL CORPORATION |
发明人 |
FANG MING;DUBIN VALERY;LU DAOQIANG |
| 分类号 |
G02B6/42;H01L21/00;H01L21/44;H01L21/48;H01L21/50;H01L21/60;H01L23/48;H01L23/485;H01L23/52;H01L27/15;H01L29/267;H01L31/12;H01L33/00;(IPC1-7):H01L21/44 |
主分类号 |
G02B6/42 |
| 代理机构 |
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