| 摘要 |
<P>PROBLEM TO BE SOLVED: To perform inspection of the mounting state of an IC chip to a substrate, in a short time, based on objective standards. <P>SOLUTION: The image data of the back of a glass substrate 1, having the IC chip 2 mounted on its surface, is acquired by a differential interference microscope 10 to be subjected to differential processing and master data, such as the pattern of the panel electrode 4 of the substrate 1 or the like, is matched with the image data to position the bump region A in the image data, to specify an inspection region C, based on the positioned bump region A and to divide the inspection region C. A dent level is detected from the standard deviation of the image brightness in the inspection region and the number of the dents is calculated from the area or shape of a white part due to binarized image data, to decide the intensity of the dents formed to a panel electrode, the number of the dents, positional shift of the dents, mixing of foreign objects and the like. Since the dent level appears in the brightness of the image and the image brightness is digitized, the dent level in the determined inspection region can be detected by a numerical value, and the quality of the mounting state of the IC chip 2 can be evaluated rapidly and objectively. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
