| 摘要 |
The invention relates to a liquid cooling system for electronic apparatuses and electronic apparatuses comprising that system. The cooling system for electronic apparatuses for enabling a cooling operation of a heat-generating element such as a CPU (200) which is mounted within a housing of the apparatus and needs cooling, comprises a cooling jacket (50), a radiator (60) and a circulation pump (70), wherein the cooling jacket (50) comprises a base-plate portion (51) being made of a material superior in heat conductivity, such as copper or the like, and formed with a flow inlet (54) and a flow outlet (55) for the liquid coolant as well as a flow passage formed in a "U" or an "I" shape within the inside thereof, and a cover portion (52); in a portion of the flow passage of the "U" or "I" shape is disposed a coolant division portion (56 and/or 57) being made up by combining a plural number of pieces of fine tubes in a bundle, each of which is also made of a material superior in heat conductivity, such as copper or the like, through brazing. <IMAGE> |
