发明名称 |
ORGANIC ELECTRONIC DEVICES WITH LOW THERMAL RESISTANCE AND PROCESSES FOR FORMING AND USING THE SAME |
摘要 |
An aspect of the present invention provides an organic electronic device includes a heat sink having a side with a roughened surface and/or a black surface and a process for forming devices having such heat sinks including forming a patterned electrically conductive layer includes an electrically conductive member. The process includes selectively forming spaced-apart members. The heat sink includes the spaced-apart members, which are spaced apart from each other and thermally coupled to the electrically conductive member. |
申请公布号 |
WO2005036664(A3) |
申请公布日期 |
2005.08.18 |
申请号 |
WO2004US33003 |
申请日期 |
2004.10.06 |
申请人 |
E.I. DUPONT DE NEMOURS AND COMPANY;YU, GANG;WANG, JIAN |
发明人 |
YU, GANG;WANG, JIAN |
分类号 |
H01L23/367;H01L23/495;H01L27/32;H01L33/64;H01L51/52 |
主分类号 |
H01L23/367 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|