发明名称 |
Capping layers with high compressive stress for spin valve sensors |
摘要 |
A capping layer employed with a spin valve sensor includes a first capping layer, formed from a refractory metal, and a second capping layer formed from silicon. The interface between the refactory metal layer and the silicon layer form a silicide that provides a large compressive stress on the underlying spin valve sensor. The compressive stress, advantageously, increases the pinning field in the self-pinned pinned layer structure, while providing a high resistivity so that less sense current is shunted by the capping layer structure compared to an all metal capping layer structure that provides a comparable compressive stress.
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申请公布号 |
US2005180057(A1) |
申请公布日期 |
2005.08.18 |
申请号 |
US20040779356 |
申请日期 |
2004.02.12 |
申请人 |
HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS, B.V |
发明人 |
FREITAG JAMES M.;PINARBASI MUSTAFA M. |
分类号 |
G11B5/127;G11B5/33;G11B5/39;(IPC1-7):G11B5/33 |
主分类号 |
G11B5/127 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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