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发明名称
STACKED IC CHIP PACKAGE INCLUDING PACKAGE INTERCONNECTING MEANS
摘要
申请公布号
KR20050080769(A)
申请公布日期
2005.08.18
申请号
KR20040008854
申请日期
2004.02.11
申请人
BARUN ELECTRONICS CO., LTD.
发明人
CHOI, WAN GYUN;JEONG, DO SOO
分类号
H01L21/52;H01L23/12;(IPC1-7):H01L23/12
主分类号
H01L21/52
代理机构
代理人
主权项
地址
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