发明名称 PACKAGING SYSTEM
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a packaging system capable of maintaining a high precision of a metering device even when the metering device easily affected by the vibration is integrated with the packaging system with a vibration generating section built therein. <P>SOLUTION: A main section to generate the mechanical vibration in the packaging system is mounted on a subframe separate from a main frame, and the subframe is mounted separately from the main frame. Alternatively, the subframe is mounted on the main frame via a vibration damping means. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005219744(A) 申请公布日期 2005.08.18
申请号 JP20020039126 申请日期 2002.02.15
申请人 ISHIDA CO LTD 发明人 YASUDA CHUSAKU;TANAKA TAKESHI;SUEKANE SHINGO;MIYAMOTO HIDESHI;ICHIKAWA MAKOTO;KONDO MASASHI;NAKAGAWA YUKIO
分类号 B65B9/00;B65B37/18;B65B59/04;B65B65/00;(IPC1-7):B65B65/00 主分类号 B65B9/00
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