PROCESS FOR PRODUCING WIRING BOARD AND PROCESS FOR FABRICATING ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To deposit a metal layer only at a required part and to form wiring by a simple production process. SOLUTION: The process for producing a wiring board comprises steps of: (a) providing a surfactant 18 in the first and second regions 12 and 14 of a substrate 10; (b) decomposing inter-atomic bonding in the second region 14 of the substrate 10 by irradiating that region with vacuum UV radiation 22; (c) removing the part of the surfactant 18 provided in the second region 14 by cleaning the substrate 10; (d) providing a catalyst 30 at the part of the surfactant 18 left in the first region 12; and (e) depositing a metal layer 34 on the catalyst 30 to form wiring of the metal layer 34 along the first region 12. COPYRIGHT: (C)2005,JPO&NCIPI