| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device not using an expensive semiconductor test device with high performance for producing a strain waveform and not requiring a jig with special devising in circuit and the like. SOLUTION: The semiconductor device 30A is so constituted that a waveform strain generation circuit 31A is arranged in front of a receiver 32. In this manner, the receiver 32 can directly receive a strain waveform signal Sdst and confirm input sensitivity of the receiver 32 in an environment close to the actual system. As a waveform strain generation circuit 31A is installed in the semiconductor device 30A, low-cost semiconductor test devices 10X and 10Y without the waveform strain generation function can be used. By fixing the capacity of a capacitor contained in the waveform strain generation circuit 31A and variably controlling the inductance of an inductor, the whole area of the of semiconductor device 30A can be reduced. COPYRIGHT: (C)2005,JPO&NCIPI
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