CONDUCTIVE POROUS MATERIAL, RESIN MOLDING USING IT, AND PROCESS FOR PRODUCING CONDUCTIVE POROUS MATERIAL
摘要
<p>A conductive porous material (1) comprising a substrate (2) having a sintered body of an oxide, communication holes (3) of very small diameter formed in the substrate (2) and exhibiting permeability to gas and impermeability to other substances, and conductive layers (4) formed on the inner walls of the communication holes (3) and generating heat as a current flows there through. Organic matters deposit to the inner walls of the communication holes (3) while the conductive material (1) is being used but the organic matters are decomposed and removed by heating the conductive layers (4). Consequently, clogging of the communication holes is prevented.</p>
申请公布号
WO2005075380(A1)
申请公布日期
2005.08.18
申请号
WO2005JP00902
申请日期
2005.01.25
申请人
TOWA CORPORATION;JAPAN FINE CERAMICS CENTER;KUNO, TAKAKI;MAEDA, KEIJI;NOGUCHI, YOSHINORI;KITAOKA, SATOSHI;KAWASHIMA, NAOKI