| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the mounting space and wiring impedance and improve the heat-dissipating performance of a semiconductor module for a DC/DC converter. <P>SOLUTION: In the semiconductor module, a power MOS chip (control-side element) 5, a power MOS chip (synchronous rectification side element), and a drive IC chip 9 for driving MOSFET gates, formed on the, chips are mounted on a mounting board 3 by flip-chip bonding method. A heat sink 53 is arranged on the back face of the power MOS chip 5 and extends to a position, where the heat sink 53 covers the driving IC chip 9. The power MOS chip 5 and the drive IC chip 9 are encapsulated with a resin material 61 into a single package. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
