| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for dividing a wafer capable of easily establishing a series of steps for forming a uniform deterioration layer in a wafer along a predetermined division line, dividing a wafer into chips, applying an adhesive film for die bonding to the rear surface of the divided chips, and picking up the divided chips. SOLUTION: The method for dividing a wafer comprises a step for sticking the surface of the wafer 2 to a dicing tape 30 fixed to an annular frame 3, a step for polishing the rear surface of the wafer, a step for forming a deterioration layer in the wafer along a predetermined division line by irradiating the wafer with a pulse laser beam transmitting the wafer from the rear surface side, a step for sticking an adhesive film for die bonding to the rear surface of the wafer, a step for dividing the wafer into individual chips along the predetermined division line by imparting an external force, a step for enlarging the interval between the chips by spreading the dicing tape, and a step for picking up each chip having rear surface applied with adhesive film for die bonding from the dicing tape thus spread. COPYRIGHT: (C)2005,JPO&NCIPI |
