| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit board device in which an electronic component is loaded on one face or both faces of an electronic circuit board, mounting density is improved, a cooling operation on the electronic component is improved, and an environment can be improved in accordance with the use environment of the electronic circuit board device, especially a high humidity environment; and to provide an electronic device using the electronic circuit board device which efficiently cools the electronic component while conformity to the electronic device is considered for loading the electronic circuit board device which is mounted with high density on the electronic device. SOLUTION: The device is provided with a first a solidified electronic component 12a installed on the surface of the electronic circuit board 11, a first electronic component heat conduction cover 14 arranged on the surface of the electronic circuit board so that it covers the first solidified electronic component 12a, and a radiation fin 13 arranged in parallel on the first electronic component heat conduction cover 14 in terms of heat conduction. A refrigerant channel 13d circulating a refrigerant rotating from a cooling device 16 is disposed in a fin base 13a of the radiation fin 13. COPYRIGHT: (C)2005,JPO&NCIPI
|
