| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for dividing a wafer capable of establishing a process for forming a deterioration layer along a predetermined division line using a pulse laser beam, dividing a wafer into individual chips along the deterioration layer, applying an adhesive film for die bonding to the rear surface of individual chips and picking up the individual chips. SOLUTION: The method for dividing a wafer comprises a step for sticking a protective member to the surface of a wafer, a step for polishing the rear surface of the wafer, a step for forming a deterioration layer by irradiating the wafer with a pulse laser beam transmitting the wafer from the rear surface side along a predetermined division line, a step for sticking an adhesive film for die bonding to the rear surface, a step for sticking the adhesive film side to a dicing tape fixed to an annular frame, a step for imparting an external force along the predetermined division line, a step for dividing the wafer into individual chips, a step for enlarging the interval between the chips by spreading the dicing tape thus breaking the adhesive film, and a step for picking up each chip. COPYRIGHT: (C)2005,JPO&NCIPI |
