| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a double-sided circuit board which can simplify its steps, realize its micromachining operation, and have a good mass productivity. SOLUTION: The method for manufacturing a double-sided circuit board includes a laser machining step of simultaneously forming a blind via hole and a through hole having arbitrary different shapes, by laser machining from one side at desired positions in a double-sided metallic laminate having metallic layers laminated on both sides of a resin layer; a metal plating step of providing a metal plated layer by metal plating a resin surface and an exposed metallic part within the through hole made by the laser machining to electrically connect both surfaces of the metallic layers; and a metallic pattern formation step of forming metallic patterns on the both surfaces. COPYRIGHT: (C)2005,JPO&NCIPI
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