发明名称 |
RESIN VAPOR JETTING NOZZLE, DEVICE FOR DEPOSITING RESIN THIN FILM, AND METHOD FOR DEPOSITING RESIN THIN FILM |
摘要 |
PROBLEM TO BE SOLVED: To provide a resin vapor jetting nozzle capable of depositing a resin thin film uniform to the pressure variation in resin vapor or uniform in the width direction of a substrate, and to provide a device for depositing a resin thin film and a method for depositing a resin thin film. SOLUTION: The resin vapor jet nozzle 201 has an opening part 103 to be fed with heated and vaporized resin and jetting the fed resin vapor. A plurality of partitions 202 are formed at the inside thereof or at the opening part 103. The length of each partition 202 is substantially the length of≥30% of the whole. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005220383(A) |
申请公布日期 |
2005.08.18 |
申请号 |
JP20040027298 |
申请日期 |
2004.02.03 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
MIYAZAWA KAZUTOSHI;TAKIZAWA TAKAHIRO |
分类号 |
C23C14/24;C23C14/12;(IPC1-7):C23C14/24 |
主分类号 |
C23C14/24 |
代理机构 |
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