发明名称 METHOD AND DEVICE FOR ELECTROLYTICALLY INCREASING THE THICKNESS OF AN ELECTRICALLY CONDUCTIVE PATTERN ON A DIELECTRIC SUBSTRATE, AS WELL AS A DIELECTRICT SUBSTRATE
摘要 The invention provides a method for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, comprising the steps of - immersing the substrate with the pattern present thereon in an electrolytic bath, - electrically contacting in the electrolytic bath a negatively charged electrode with the pattern during immersion of the substrate, and - effecting contacting movement in the electrolytic bath of the electrode and the pattern with respect to each other during immersion of the substrate. The invention furthermore provides a device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate.
申请公布号 WO2005076680(A2) 申请公布日期 2005.08.18
申请号 WO2005NL00064 申请日期 2005.01.28
申请人 BESI PLATING B.V.;LOERMANS, PETER, JACOBUS, GERARDUS;VAN DE VEN, AUGUSTINUS, CORNELIS, MARIA 发明人 LOERMANS, PETER, JACOBUS, GERARDUS;VAN DE VEN, AUGUSTINUS, CORNELIS, MARIA
分类号 C25D5/02;C25D5/04;C25D7/00;C25D7/06;C25D21/00;H05K1/00;H05K3/18;H05K3/24 主分类号 C25D5/02
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