METHOD AND DEVICE FOR ELECTROLYTICALLY INCREASING THE THICKNESS OF AN ELECTRICALLY CONDUCTIVE PATTERN ON A DIELECTRIC SUBSTRATE, AS WELL AS A DIELECTRICT SUBSTRATE
摘要
The invention provides a method for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, comprising the steps of - immersing the substrate with the pattern present thereon in an electrolytic bath, - electrically contacting in the electrolytic bath a negatively charged electrode with the pattern during immersion of the substrate, and - effecting contacting movement in the electrolytic bath of the electrode and the pattern with respect to each other during immersion of the substrate. The invention furthermore provides a device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate.
申请公布号
WO2005076680(A2)
申请公布日期
2005.08.18
申请号
WO2005NL00064
申请日期
2005.01.28
申请人
BESI PLATING B.V.;LOERMANS, PETER, JACOBUS, GERARDUS;VAN DE VEN, AUGUSTINUS, CORNELIS, MARIA
发明人
LOERMANS, PETER, JACOBUS, GERARDUS;VAN DE VEN, AUGUSTINUS, CORNELIS, MARIA