CURABLE RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a curable resin composition using an epoxy silica hybrid material and having excellent heat resistance as compared with that of conventional compositions without especially a change in storage elastic modulus from low to high temperatures and having excellent storage stability when used as a one-package type. SOLUTION: The curable resin composition comprises a silane compound (A) in which an epoxy group is bound through an organic group which may contain a nitrogen atom or an oxygen atom to a silicon atom and a silane compound (B) in which a ketimine group is bound through an organic group which may contain a nitrogen atom or an oxygen atom to the silicon atom. At least a part of the silane compound (A) and/or the silane compound (B) are condensates. COPYRIGHT: (C)2005,JPO&NCIPI