发明名称 |
Stack MCP and manufacturing method thereof |
摘要 |
A semiconductor chip having an adhesive layer previously formed on an element forming surface thereof and having a bump exposed from the surface of the adhesive layer is wire-bonded to a printed circuit board. Another semiconductor chip is stacked on the above semiconductor chip with the adhesive layer disposed therebetween and is wire-bonded to the printed circuit board by wire bonding. Likewise, at least one semiconductor chip is sequentially stacked on the thus attained semiconductor structure to form a stack MCP.
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申请公布号 |
US2005179127(A1) |
申请公布日期 |
2005.08.18 |
申请号 |
US20040891513 |
申请日期 |
2004.07.15 |
申请人 |
TAKYU SHINYA;IIZUKA KAZUHIRO;KIRITANI MIKA |
发明人 |
TAKYU SHINYA;IIZUKA KAZUHIRO;KIRITANI MIKA |
分类号 |
H01L25/18;H01L21/50;H01L21/60;H01L21/98;H01L23/02;H01L23/34;H01L25/00;H01L25/04;H01L25/065;H01L25/07;(IPC1-7):H01L23/02 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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